发明名称 |
Method for Producing Optoelectronic Semiconductor Components, Leadframe Assemblage and Optoelectronic Semiconductor Component |
摘要 |
A method serves to produce optoelectronic semiconductor components. A leadframe assemblage includes a number of leadframes. The leadframes each comprise at least two leadframe parts and are connected together at least in part via connecting webs. Electrical connections are attached between neighboring leadframes. A potting body connects the leadframes and the leadframe parts mechanically together. At least some of the connecting webs are removed and/or interrupted, the resulting structure is singulated into the semiconductor components. |
申请公布号 |
US2014353710(A1) |
申请公布日期 |
2014.12.04 |
申请号 |
US201214363738 |
申请日期 |
2012.12.13 |
申请人 |
OSRAM Opto Semiconductors GmbH |
发明人 |
Zitzlsperger Michael;Holz Jürgen |
分类号 |
H01L33/62;H01L33/52;H01L21/66;H01L25/13 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Regensburg DE |