LIGHT SOURCE PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

A package for a light source is disclosed. In particular, a Plastic Leaded Chip Carrier (PLCC) is described which provides enhanced heat dissipating properties. Moreover, the PLCC is described as comprising a single-gage leadframe, which provides for enhanced design flexibility and reduced manufacturing costs. Methods of manufacturing light source packages are also disclosed.

主权项

1. An optical device, comprising:
a single-gage leadframe comprising a bonding pad having a top surface and an opposing bottom surface, a first conductive lead, and a second conductive lead, wherein at least one of the first and second conductive leads comprise a stitch pad configured for wire bonding that is elevated relative to the top surface of the boding pad; a non-conductive housing that physically separates the bonding pad from both the first conductive lead and the second conductive lead as well, at least a portion of the bonding pad bottom surface being exposed through a bottom face of the housing, and at least a portion of the stitch pad being exposed through the housing; and a light source mounted to the top surface of the bonding pad.