| 发明名称 |
INSULATION RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD HAVING IMPROVED THERMAL CONDUCTIVITY AND ELECTRICAL PROPERTIES, INSULATING FILM, PREPREG AND PRINTED CIRCUIT BOARD |
| 摘要 |
Disclosed herein are an insulation resin composition for a printed circuit board including: an epoxy resin, a first inorganic filler having thermal conductivity of 20 W/mK or more, and a second inorganic filler having relative permittivity less than 10, and an insulating film, a prepreg, and a printed circuit board. |
| 申请公布号 |
US2014353004(A1) |
申请公布日期 |
2014.12.04 |
| 申请号 |
US201414270131 |
申请日期 |
2014.05.05 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
Jung Hyun Chul;Kang Joon Seok;Son Jang Bae;Shin Sang Hyun;Lee Kwang Jik;Shin Hye Sook |
| 分类号 |
H05K1/03;B05D3/00;C08K3/22;C08K3/38;C08K3/36 |
主分类号 |
H05K1/03 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An insulation resin composition for a printed circuit board comprising:
an epoxy resin; a first inorganic filler having thermal conductivity of 20 W/mK or more and an average particle diameter of 1 to 200 μm; and a second inorganic filler having relative permittivity less than 10 and an average particle diameter of 0.01 to 1 μm. |
| 地址 |
Suwon-Si KR |
