发明名称 HYDROPHOBIC INORGANIC PARTICLES, RESIN COMPOSITION FOR HEAT DISSIPATION MEMBER, AND ELECTRONIC COMPONENT DEVICE
摘要 The present invention pertains to hydrophobic inorganic particles obtained by modifying the surfaces of inorganic particles with an organic compound. After adding 200 parts by mass of ethanol to one part by mass of said hydrophobic inorganic particles, performing ultrasonic cleaning for 10 minutes, and performing solid-liquid separation, when 0.1 g of dried hydrophobic inorganic particles are dispersed in 40 g of a mixed liquid obtained by mixing hexane and water at a 1:1 volume ratio, at least 50 mass% of the hydrophobic inorganic particles transition to a hexane-containing phase. Hydrophobic inorganic particles capable of balancing excellent fluidity and excellent thermal conductivity in a resin composition, and a resin composition containing said inorganic particles, are provided by the present invention.
申请公布号 WO2014192402(A1) 申请公布日期 2014.12.04
申请号 WO2014JP59415 申请日期 2014.03.31
申请人 SUMITOMO BAKELITE CO., LTD. 发明人 MAEDA SHIGEYUKI
分类号 C09C3/08;C08K9/04;C08L101/00;C09K5/08 主分类号 C09C3/08
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