| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent warpage and a chip at edge of a substrate by attaching a tape such as a protective tape to the substrate such as a semiconductor wafer without residual stress.SOLUTION: A tape attachment device 1 for attaching a tape T to a substrate W comprises a holding table 9, tape supply means 15, an attachment unit 40 and a holding roller 43 provided between the tape supply means 15 and the attachment unit 40. The attachment unit 40 includes an attachment roller 47, advancing rollers 44 for holding the tape T in an inclined state, peeling means 51 for peeling a separator S, and a moving frame 41 which collectively hold the attachment roller 47, the advancing rollers 44 and the peeling means 51 and is movable in parallel to an attachment surface of the substrate W. The holding roller 43 is arranged in parallel to the advancing rollers 44 thereby to hold the tape T in a parallel fashion between the advancing rollers 44 and the holding roller 43.</p> |
