LAMINATING MANUFACTURING METHOD FOR OVERSIZED PCB BACKBOARD

摘要

The present invention is applied to the technical field of PCB backboard manufacturing. Provided is a laminating manufacturing method for an oversized PCB backboard. The PCB backboard comprises multiple core boards, and the manufacturing method therefor comprises: a browning step: after performing browning processing on each of the core boards, drying same; a riveting step: adding a PP sheet between every two core boards, and riveting the multiple core boards between which the PP sheets are added together on a riveting machine to form a multi-layer core board; an arranging step: arranging the riveted multi-layer core board on a steel board, and superposing same with other materials required by laminating; and a laminating step: pushing the superposed multi-layer core board into a hot press, and melting the PP sheet after high temperature and high pressure so as to bind each of the core boards together. By way of improving each step in the process of laminating manufacturing a PCB backboard, the present invention effectively reduces the generation of a cavity and bubble after laminating the PCB backboard, thereby effectively reducing the problem of short circuit caused by copper infiltration after laminating the PCB backboard.