| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method of a wiring board which prevents side etching of a wiring pattern (electrolytic copper).SOLUTION: The processing method comprises: a first step where, in a semi-additive method, a substrate including electroless copper as a seed layer and electrolytic copper as a wiring pattern is contacted with a liquid composition for an etching pretreatment containing chloride ions; and a subsequent second step where the treated wiring board is etched by a liquid composition for etching containing hydrogen peroxide, sulfuric acid, tetrazoles, chloride ions, copper ions, and water. |
