| 摘要 |
<p>PROBLEM TO BE SOLVED: To form a conductor pattern having low specific resistance on a substrate composed of an inexpensive material having low heat resistance with high adhesion by using a conductive paste containing metal nanoparticles.SOLUTION: A circuit board manufacturing method comprises: printing conductor patterns 1a on a film base material 3 composed of a material such as polyimide (PI) and polytetrafluoroethylene (PTFE) by a conductive paste 13 and burning the conductor patterns 1a; and peeling the conductor patterns 1a after burning from the film base material 3 and transferring the conductor patterns 1a on a film substrate 1b composed of a material such as polyethylene terephthalate (PET) and polyethylene (PE) and adhering the conductor patterns 1a by an adhesive 5c. The film base material 3 from which the conductor patterns 1a are peeled is reused for printing and burning of the conductor patterns 1a by the conductive paste 13.</p> |
