| 发明名称 |
SPUTTERING APPARATUS |
| 摘要 |
A sputtering apparatus for depositing a deposition material on a substrate, the sputtering apparatus including a chamber; a target in the chamber, the target including the deposition material; and a shield between the substrate and an inner wall of the chamber, the shield including a plurality of sub-shields. |
| 申请公布号 |
US2014353150(A1) |
申请公布日期 |
2014.12.04 |
| 申请号 |
US201414253236 |
申请日期 |
2014.04.15 |
| 申请人 |
SAMSUNG SDI CO., LTD. |
发明人 |
PARK Jae-Bum;PARK Bo-Hwan;KANG Eui-Jung |
| 分类号 |
H01J37/32 |
主分类号 |
H01J37/32 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A sputtering apparatus for depositing a deposition material on a substrate, the sputtering apparatus comprising:
a chamber; a target in the chamber, the target including the deposition material; and a shield between the substrate and an inner wall of the chamber, the shield including a plurality of sub-shields. |
| 地址 |
Yongin-si KR |
