PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

A wiring board includes a core substrate including an insulative substrate and a first inner conductive-circuit layer formed on first surface of the insulative substrate, an electronic component positioned in a penetrating hole formed in the insulative substrate and having a positive electrode terminal on first end portion and a negative electrode terminal on second end portion on the opposite side, a first interlayer insulative resin layer formed on first surface of the core such that the first insulative layer is positioned over the core and component in the penetrating hole, and an outer conductive-circuit layer formed on surface of the first insulative layer such that thicknesses of the first insulative layer between the outer conductive-circuit layer and the terminals are less than thickness of the first insulative layer between the first inner conductive-circuit layer and the outer conductive-circuit layer.

主权项

1. A wiring board, comprising:
a core substrate comprising an insulative substrate and a first inner conductive-circuit layer formed on a first surface of the insulative substrate; an electronic component positioned in a penetrating hole formed in the insulative substrate of the core substrate and having a positive electrode terminal on a first end portion and a negative electrode terminal on a second end portion on an opposite side with respect to the first end portion; a first interlayer insulative resin layer formed on a first surface of the core substrate such that the first interlayer insulative resin layer is positioned over the core substrate and the electronic component in the penetrating hole; and an outer conductive-circuit layer formed on a surface of the first interlayer insulative resin layer such that thicknesses of the first interlayer insulative resin layer between the outer conductive-circuit layer and the positive electrode terminal and between the outer conductive-circuit layer and negative electrode terminal are less than a thickness of the first interlayer insulative resin layer between the first inner conductive-circuit layer and the outer conductive-circuit layer.