发明名称 |
METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE, AND SILICON CARBIDE SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a silicon carbide semiconductor device capable of improving a manufacturing yield of a semiconductor module.SOLUTION: A method of manufacturing a silicon carbide semiconductor device includes the following steps of: preparing a silicon carbide substrate 20; forming a plurality of element parts 80 on the silicon carbide substrate 20; forming a first groove part 90 between the plurality of element parts 80; measuring a withstanding voltage of the element parts 80; and separating the plurality of element parts 80 from each other in the first groove part 90 after measuring the withstanding voltage of the element parts 80.</p> |
申请公布号 |
JP2014225557(A) |
申请公布日期 |
2014.12.04 |
申请号 |
JP20130103955 |
申请日期 |
2013.05.16 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
SAKAI MITSUHIKO |
分类号 |
H01L21/336;H01L21/66;H01L29/12;H01L29/78 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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