发明名称 METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE, AND SILICON CARBIDE SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
摘要 <p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a silicon carbide semiconductor device capable of improving a manufacturing yield of a semiconductor module.SOLUTION: A method of manufacturing a silicon carbide semiconductor device includes the following steps of: preparing a silicon carbide substrate 20; forming a plurality of element parts 80 on the silicon carbide substrate 20; forming a first groove part 90 between the plurality of element parts 80; measuring a withstanding voltage of the element parts 80; and separating the plurality of element parts 80 from each other in the first groove part 90 after measuring the withstanding voltage of the element parts 80.</p>
申请公布号 JP2014225557(A) 申请公布日期 2014.12.04
申请号 JP20130103955 申请日期 2013.05.16
申请人 SUMITOMO ELECTRIC IND LTD 发明人 SAKAI MITSUHIKO
分类号 H01L21/336;H01L21/66;H01L29/12;H01L29/78 主分类号 H01L21/336
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