| 摘要 |
Provided is an electromagnetic wave shielding film which is capable of preventing delamination between a metal thin film and an adhesive layer, as well as a printed wire board using same. The electromagnetic wave shielding film (1) has a configuration in which at least a metal thin film (4) and an adhesive layer (5) are successively deposited, wherein the water vapor transmission rate according to JIS K7129 is greater than or equal to 0.5 g/m2/24 h at a temperature of 80 °C, a humidity of 95% RH, and a differential pressure of 1 atm. |
