SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a semiconductor device and a manufacturing method thereof. A technical objective to be solved is a semiconductor device to form more stable structure which is in electrical contact with a separate semiconductor device without damage to a redistribution layer, and a manufacturing method thereof. For this, disclosed is the semiconductor device which includes: a semiconductor die; an encapsulation part formed in the side of the semiconductor die; a dielectric layer formed in the upper part of the encapsulation part and the semiconductor die; a redistribution layer which penetrates one part of the dielectric layer and is electrically connected to the semiconductor die; a solder ball which penetrates another part of the dielectric layer, is electrically connected to the redistribution layer, and is exposed to the outside; and a conductive via which penetrates the encapsulation part and is electrically connected to the redistribution layer.