| 摘要 |
An electroless plating bath composition of matter and corresponding method are described. The plating bath is an aqueous solution including an amino acid having at least one amino moiety and at least one carboxylic acid moiety or a polypeptide thereof, and having a molar ratio of amino moieties to carboxylic acid moieties of 1 or greater, a nickel-containing or a cobalt-containing salt, and a boron-containing reducing agent. The composition of matter is used in a method of electroless nickle-boron and cobalt-boron coating of substrates. |
