HOLLOW SEALING SHEET AND METHOD OF PRODUCING HOLLOW PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a hollow sealing sheet capable of producing a hollow package having high reliability, and to provide a method of manufacturing the hollow package.SOLUTION: A hollow sealing sheet for sealing an electronic component in a hollow manner contains a resin and is controlled in resin entering property into a hollow part at 40°C or more and 100°C or less. A molding metal die having a 20μm width slit is filled with the resin, and the amount of resin entering the slit is preferable to be 3 mm or less when the resin is pressurized for 10 minutes at pressure 10 kg/cm2 and temperature 150°C.