METHODS FOR HIGH PRECISION MICROELECTRONIC DIE INTEGRATION

摘要

The subject matter of the present description relates to methods for the precise integration of microelectronic dice within a multichip package which substantially reduce or eliminate any misalign caused by the movement of the microelectronic dice during the integration process. These methods may include the use of a temporary adhesive in conjunction with a carrier having at least one recess for microelectronic die alignment, the use of a precision molded carrier for microelectronic die alignment, the use of magnetic alignment of microelectronic dice on a reusable carrier, and/or the use of a temporary adhesive with molding processes on a reusable carrier.

主权项

1. A method comprising
forming a first carrier having a first surface and a second surface; forming at least one recess extending into the first carrier from the first carrier first surface; disposing an adhesive material layer over the first carrier first surface and into each of the first carrier recesses providing at least one microelectronic die having an active surface and an opposing back surface with at least one sidewall extending therebetween and having a plurality of interconnection structures extending from the microelectronic die active surface; adhering the at least one microelectronic die to the adhesive material layer such that at least one microelectronic die interconnection structure extends into at least one first carrier recess; encapsulating the at least one microelectronic die with a mold material; attaching a second carrier to the encapsulant material with an adhesive layer; and removing the first carrier and the die-bonding adhesive layer.