| 发明名称 |
TEMPERATURE CONTROLLED SUBSTRATE SUPPORT ASSEMBLY |
| 摘要 |
A temperature controlled substrate support assembly used for processing a substrate in a vacuum chamber of a semiconductor processing apparatus. The substrate support assembly comprises a top plate for supporting the substrate. A base plate is disposed below the top plate wherein the base plate comprises a cavity in an upper surface of the base plate. A cover plate is disposed between the top plate and the base plate. At least one thermoelectric module is in the cavity in the upper surface of the base plate wherein the at least one thermoelectric module is in thermal contact with the top plate and the base plate, and the at least one thermoelectric module is maintained at atmospheric pressure. |
| 申请公布号 |
US2014356985(A1) |
申请公布日期 |
2014.12.04 |
| 申请号 |
US201313908676 |
申请日期 |
2013.06.03 |
| 申请人 |
Lam Research Corporation |
发明人 |
Ricci Anthony;Povolny Henry |
| 分类号 |
H01L21/66;H01J37/32;C23C16/46 |
主分类号 |
H01L21/66 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A temperature controlled substrate support assembly for processing a substrate in a vacuum chamber of a semiconductor processing apparatus comprising:
a top plate configured to support the substrate; a base plate disposed below the top plate wherein the base plate comprises a cavity in an upper surface of the base plate; a cover plate enclosing the cavity and disposed between the top plate and the base plate; and at least one thermoelectric module in the cavity in the upper surface of the base plate wherein the at least one thermoelectric module is in thermal contact with the top plate and the base plate, and the at least one thermoelectric module is maintained at atmospheric pressure. |
| 地址 |
Fremont CA US |
