Semiconductor packaging container, Semiconductor device, Electronic device

摘要

A semiconductor packaging container allowing to use in millimeter band is provided at a low cost. The inner SIG pads and the inner GND pads, capable of a direct connection with a signal terminal of a semiconductor chip 10 are provided on the bottomed cylindrical dielectric case formed of the liquid crystal polymer. Further, the external SIG pads integrally formed with the inner SIG pads 201, 202 and the external GND pad 303 integrally formed with the inner GND pad are provided on the back of the bottom surface of the dielectric case as the external terminal. The inner GND pads and are to form the coplanar waveguide with the inner SIG pads and. Also, the inner GND pads and are to add capacitive reactance for canceling the inductance caused by the space at the semiconductor chip portion to the coplanar waveguide.

主权项

1. A semiconductor packaging container comprising a bottomed cylindrical dielectric case including dielectric except for ceramics, comprising:
a first signal conductor and a first grounding conductor provided on a bottom surface of the dielectric case, the first conductor being capable of a direct connection with a signal terminal of a semiconductor chip, and the first grounding conductor forming a coplanar waveguide with the first signal conductor, and a second signal conductor provided at a position corresponding to the first signal conductor on the back of the bottom surface of the dielectric case, and a second grounding conductor provided at a position corresponding to the first grounding conductor on the back of the bottom surface of the dielectric case, wherein an electrical continuity is established between the first signal conductor and the second signal conductor through a via which passes through the bottom surface of the dielectric case and an electrical continuity is established between the first grounding conductor and the second grounding conductor through a via which passes through the bottom surface of the dielectric case.