| 发明名称 |
METHODS FOR STICTION REDUCTION IN MEMS SENSORS |
| 摘要 |
A method of the invention includes reducing stiction of a MEMS device by providing a conductive path for electric charge collected on a bump stop formed on a substrate. The bump stop is formed by depositing and patterning a dielectric material on the substrate, and the conductive path is provided by a conductive layer deposited on the bump stop. The conductive layer can also be roughened to reduce stiction. |
| 申请公布号 |
US2014353774(A1) |
申请公布日期 |
2014.12.04 |
| 申请号 |
US201313909842 |
申请日期 |
2013.06.04 |
| 申请人 |
Invensense, Inc. |
发明人 |
Zhang Cerina;Tea Nim |
| 分类号 |
H01L21/768;H01L23/48;H01L29/84 |
主分类号 |
H01L21/768 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of reducing stiction of a MEMS device comprising:
providing a conductive path for electric charge collected on a bump stop formed on a substrate, wherein the bump stop is formed by depositing and patterning a dielectric material on the substrate, further wherein the conductive path is provided by a first conductive layer deposited on the bump stop. |
| 地址 |
Sunnyvale CA US |
