发明名称 LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME, LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM
摘要 A light emitting device includes an active layer formed between first and second semiconductor layers. The first semiconductor layer includes a first surface facing the active layer, a second surface opposing the first surface, and a side surface that includes a stepped portion. The stepped portion causes the side surface to extend beyond one of the first surface or second surface of the first semiconductor layer. A light emitting device may also be formed with a buffer layer that includes a stepped portion, and a light emitting device package and system may be formed from the light emitting devices.
申请公布号 US2014353580(A1) 申请公布日期 2014.12.04
申请号 US201414336756 申请日期 2014.07.21
申请人 LG INNOTEK CO., LTD. 发明人 KANG Dae Sung;WON Jung Min
分类号 H01L33/20;H01L33/32;H01L33/46;H01L33/06 主分类号 H01L33/20
代理机构 代理人
主权项 1. A light emitting device comprising: a metal layer; a light emitting structure on the metal layer, including a first semiconductor layer, a second semiconductor layer, an active layer between the first semiconductor layer and the second semiconductor layer; and a first electrode on at least one of the light emitting structure; wherein the light emitting structure includes an inclined lower portion and an upper portion on the lower portion; wherein the light emitting structure has a stepped structure between the lower portion and the upper portion; wherein the lower portion has an inverted trapezoidal shape which has a top surface and a bottom surface; and wherein a width of the top surface is wider than that of the bottom surface.
地址 Seoul KR