发明名称 |
LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME, LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM |
摘要 |
A light emitting device includes an active layer formed between first and second semiconductor layers. The first semiconductor layer includes a first surface facing the active layer, a second surface opposing the first surface, and a side surface that includes a stepped portion. The stepped portion causes the side surface to extend beyond one of the first surface or second surface of the first semiconductor layer. A light emitting device may also be formed with a buffer layer that includes a stepped portion, and a light emitting device package and system may be formed from the light emitting devices. |
申请公布号 |
US2014353580(A1) |
申请公布日期 |
2014.12.04 |
申请号 |
US201414336756 |
申请日期 |
2014.07.21 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
KANG Dae Sung;WON Jung Min |
分类号 |
H01L33/20;H01L33/32;H01L33/46;H01L33/06 |
主分类号 |
H01L33/20 |
代理机构 |
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代理人 |
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主权项 |
1. A light emitting device comprising:
a metal layer; a light emitting structure on the metal layer, including a first semiconductor layer, a second semiconductor layer, an active layer between the first semiconductor layer and the second semiconductor layer; and a first electrode on at least one of the light emitting structure; wherein the light emitting structure includes an inclined lower portion and an upper portion on the lower portion; wherein the light emitting structure has a stepped structure between the lower portion and the upper portion; wherein the lower portion has an inverted trapezoidal shape which has a top surface and a bottom surface; and wherein a width of the top surface is wider than that of the bottom surface. |
地址 |
Seoul KR |