| 摘要 |
<p>The present invention relates to a combi-type IC card manufacturing system for bonding an IC chip to an IC card by means of a solder solution, comprising: a press welding unit for bonding the IC chip to the IC card by means of the solder solution by sequentially applying a heat seal press, an ultrasonic welding press, and a cooling press thereto, wherein the ultrasonic welding press radiates ultrasonic waves from under the bottom of the IC card to the bonded parts of the IC chip and IC card when the press compresses the bonded parts with a predetermined pressure from over the top of the IC chip. Implemented in the present invention is a combi-type IC card manufacturing system for bonding an IC card and an IC chip by using an ultrasonic welding press. The present invention allows the IC chip to be securely bonded to the IC card by sequentially applying the heat seal press, ultrasonic welding press, and cooling press to the bonded parts of the IC card and IC chip. Accordingly, the present invention solves the problem of two bonded points falling apart or electrical short circuits occurring frequently when manufacturing or using a conventional combi-type IC card, improves the quality of the card, and significantly reduces the defect rate during manufacturing.</p> |
