| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that easily manufactures the semiconductor device and is excellent in productivity. <P>SOLUTION: The method of manufacturing the semiconductor device includes the processes of: forming an insulating resin layer 12 covering a plurality of projection electrodes 10a on a circuit surface S1; fitting a semiconductor wafer 10 to a dicing frame 14 and a dicing tape 16; dicing the semiconductor wafer 10 and insulating resin layer 12 from the side of the circuit surface S1 of the semiconductor wafer 10 to divide the semiconductor wafer into a plurality of individual semiconductor chips 20; positioning the projection electrode 10a of a semiconductor chip 20 and a circuit electrode on a substrate in a state wherein the picked-up semiconductor chip 20 is held by a positioning head, and then temporarily fixing them; and heating and press-fixing the semiconductor chip 20 and substrate using a connection head to electrically connect the projection electrode 10a of the semiconductor chip 20 to the circuit electrode of the substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
