| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide Pb-free Au-Sn based alloy solder for high temperature superior in sufficient wetting and reliability or the like by having a melting point not exceeding 300-340°C in joining, requiring always high reliability. <P>SOLUTION: The Au-Sn alloy solder contains 18.5-23.5 mass% of Sn, contains at least one of 0.02-0.5 mass% of W or 0.02-4.3 mass% of Mo, and the remaining includes Au. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
