| 摘要 |
Provided is a chip-type semiconductor ceramic electronic component including a ceramic body made of a semiconductor ceramic, first external electrodes formed on opposite end surfaces of the ceramic body, and second external electrodes extending to cover surfaces of the first external electrodes and part of side surfaces of the ceramic body. The electronic component has a small variation in resistance values and a small resistance change caused by thermal shocks, and provides superior performance in mounting onto a substrate. Assuming that a curvature radius of a corner portion of the ceramic body is R (µm), a maximum thickness of a layer of the first external electrode layer, which is in contact with the ceramic body, measured from the end surface of the ceramic body is y (µm), and a minimum thickness of a layer of the second external electrode, which is in contact with the side surface of the ceramic body, measured from an apex of the corner portion of the ceramic body is x (µm), 20 ‰¤ R ‰¤ 50 is satisfied, -0.4x + 0.6 ‰¤ y ‰¤ 0.4 is satisfied on condition of 0.5 ‰¤ x ‰¤ 1.1, and -0.0076x + 0.16836 ‰¤ y ‰¤ 0.4 is satisfied on condition of 1.1 ‰¤ x ‰¤ 9.0. |
