| 摘要 |
PROBLEM TO BE SOLVED: To provide lead-free Au-Sn alloy solder for a high temperature being sufficiently used in joining requiring very high reliability, having an operation temperature that is <400°C, preferably, ≤370°C, being excellent in wettability, and obtaining high joining strength.SOLUTION: The Au-Sn alloy solder contains ≥18.5 mass% and ≤23.5 mass% of Sn, and contains at least one of ≥0.001 mass% and ≤0.5 mass% of P or ≥0.03 mass% and ≤1.5 mass% of Ge, and the balance Au. |
