| 摘要 |
PROBLEM TO BE SOLVED: To directly and early detect a defect such as a thickness reduction and a crack occurring in piping or a device for composing a plant while the plant is operated, and to monitor the soundness of the piping or the device. SOLUTION: A piping and device monitoring apparatus is equipped with: an electromagnetic ultrasonic probe 11 mounted to the piping 1 by a permanent magnet 17, and transmitting and receiving an ultrasonic wave; a wireless transmitter 12 for transmitting a measurement data measured by the electromagnetic ultrasonic probe 11; a harvester power supply 13 for supplying the electromagnetic ultrasonic probe 11 and the wireless transmitter 12 with power; and a signal processing section 10B for receiving the measurement data from the wireless transmitter 12 to find the defect. COPYRIGHT: (C)2011,JPO&INPIT |
