发明名称 Data center temperature forecasting
摘要 <p>Historical high-spatial-resolution temperature data and dynamic temperature sensor measurement data may be used to predict temperature. A first formulation may be derived based on the historical high-spatial-resolution temperature data for determining a temperature at any point in 3-dimensional space. The dynamic temperature sensor measurement data may be calibrated based on the historical high-spatial-resolution temperature data at a corresponding historical time. Sensor temperature data at a plurality of sensor locations may be predicted for a future time based on the calibrated dynamic temperature sensor measurement data. A three-dimensional temperature spatial distribution associated with the future time may be generated based on the forecasted sensor temperature data and the first formulation. The three-dimensional temperature spatial distribution associated with the future time may be projected to a two-dimensional temperature distribution, and temperature in the future time for a selected space location may be forecasted dynamically based on said two-dimensional temperature distribution.</p>
申请公布号 GB2499088(B) 申请公布日期 2014.12.03
申请号 GB20120022537 申请日期 2012.12.14
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 HONGFEI LI;HENDRIK HAMANN
分类号 G06Q10/06;G01K7/42;G06F1/20;H05K7/20 主分类号 G06Q10/06
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