| 摘要 |
Disclosed in the present invention is a substrate cutting apparatus in a local dust collection method, which has improved dust collection efficiency. The substrate cutting apparatus comprises: a jig where multiple penetrating units are formed in order to correspond to a substrate cutting line; a horizontal driving means which moves the jig in a horizontal direction; a cutting device which is installed in the upper part of the jig; a first vertical driving means which elevates the cutting device; a dust collecting tube which is installed at a position corresponding to the cutting device in the lower part of the jig; and a second horizontal driving means which elevates the dust collecting tube. Because a substrate cutting process progresses in a state where the dust collecting tube is positioned in the vertical lower part of a substrate cutting position, a consistent exhaust pressure applies to a cut part all the time. Therefore, the substrate cutting apparatus can miniaturize a motor and a dust collecting device by removing the need of a large motor in preparation for a reduction in the exhaust pressure in the latter stage of the process. In addition, the substrate cutting apparatus can significantly increase dust collection efficiency by sucking dust in the vertical lower part of the substrate cutting position in order to minimize dust scattering. |
