发明名称 金属含浸炭素系基板、これを含む放熱材料及び金属含浸炭素系基板の製造方法
摘要 PROBLEM TO BE SOLVED: To solve the problem in which: heat dissipation materials made from inorganic-based materials such as a ceramic substrate and a diamond substrate have high hardness and low workability; and those made from carbon-based materials such as a graphite film and carbon nano-tubes have low heat dissipation. SOLUTION: A manufacturing method of a heat dissipation material includes: removing aluminum deposited on the surface of an aluminum-impregnated graphite substrate by means of a wet etching method with hydrochloric acid (step 101); and then, forming an irregular structure in the order of nanometers on the surface of the aluminum impregnation graphite substrate (step 102). COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5634805(B2) 申请公布日期 2014.12.03
申请号 JP20100199547 申请日期 2010.09.07
申请人 发明人
分类号 H01L23/373;C01B31/04 主分类号 H01L23/373
代理机构 代理人
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