| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-cavity wiring board that reliably facilitates the identification of a failed wiring board region and has high connection reliability to, for example, an external electric circuit. SOLUTION: A multi-cavity wiring board 9 includes multiple wiring board regions 2 arranged in a matrix on a motherboard 1, the wiring substrate region 2 having an electronic component mounting part 2b on the top surface and a connection pad 4 on the underside, the connection pad 4 having a surface covered with a plating layer 5 where, in the case that one of the wiring board regions 2 is identified as a defective wiring board, the wiring board region is partially or entirely removed on a part of the connection pad 4 by a laser beam in the thickness direction of the plating layer 5 and a part of the plating layer 5 or the connection pad 4 are exposed and oxidized. For example, the exposed and oxidized plating layer 5 serves as a failure detection mark, so that the mark can be easily identified. Since vaporized components or the like are not contained, the connection reliability of, for example, the connection pads 4 is not reduced by the vaporized components. COPYRIGHT: (C)2011,JPO&INPIT |
