发明名称 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。
摘要 The invention provides a treatment copper foil, which is low in roughness and high in peeling strength with an insulating resin substrate. After an absorption treatment, an active processing liquid after being impregnated is low in deterioration rate of the peeling strength, less in penetration amount and excellent in etching property. The copper foil is characterized in that the surface of the copper foil is sequentially equipped with a roughening treatment layer, a chromate layer and a silane coupling agent layer. The ten-point average roughness Rz of the copper foil surface is 1.0 mu m to 2.7 mu m. When the surface of the copper coil with the area thereof 177 mu M2 is measured by purple laser of visible light with the wavelength thereof 408 nm, the average interval S of local peaks is below 0.0230 mm and S does not include 0.
申请公布号 JP5634103(B2) 申请公布日期 2014.12.03
申请号 JP20100087798 申请日期 2010.04.06
申请人 发明人
分类号 C23C28/00;B32B15/08;C25D7/06;H05K1/09;H05K3/38 主分类号 C23C28/00
代理机构 代理人
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