发明名称 CURABLE EPOXY COMPOSITION AND SHORT-CURE METHOD
摘要 <p>Disclosed herein is a method for utilizing the exothermic energy generated by a low temperature cure reaction to access a high-temperature cure reaction, which is otherwise energetically inaccessible at a chosen tool temperature, thereby producing a cured resin matrix with properties closely matching to those produced via high-temperature cure reactions but achieved via a short cure time and low cure temperature. Also disclosed is a short-cure resin composition containing: (a) at least one multifunctional epoxy resin having an epoxy functionality of greater than 1; (b) a hardener composition containing (i) at least one aliphatic or cycloaliphatic amine curing agent having one or more amino groups per molecule; (ii) at least one aromatic amine curing agent having one or more amino groups per molecule; and optionally, (iii) an imidazole as curing accelerator. The improved properties of this resin composition include being curable at a temperature of≰120° C. for a time period of less than 10 minutes to achieve a degree of cure higher than that derived from the same composition with just (i) aliphatic/cycloaliphatic amine or (ii) aromatic amine in isolation.</p>
申请公布号 KR20140138110(A) 申请公布日期 2014.12.03
申请号 KR20147017733 申请日期 2013.02.25
申请人 CYTEC TECHNOLOGY CORP. 发明人 MEEGAN JONATHAN E.
分类号 C08G59/50;C08G59/32;C08G59/56 主分类号 C08G59/50
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