发明名称 半田接続構造とそれを備えた表示装置
摘要 PROBLEM TO BE SOLVED: To visually determine whether conductive films are soldered to each other normally. SOLUTION: A solder connection structure is constituted by arranging a sub wiring board 8 having a second wiring 82a formed on a main wiring board 6 having a first wiring 62a formed so that the second wiring 82a corresponds to the first wiring 62a, and connecting the first wiring 62a and second wiring 82a together with solder 9, and one of the first wiring 62a and second wiring 82a at a portion where the first wiring 62a and second wiring 82a are covered with the solder 9, has a narrow-width portion formed by reducing the width of one of the wirings. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP5633164(B2) 申请公布日期 2014.12.03
申请号 JP20100064188 申请日期 2010.03.19
申请人 发明人
分类号 H05K1/14;G02F1/1333;G02F1/1345;G09F9/00;H05K1/11 主分类号 H05K1/14
代理机构 代理人
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