| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package which improves the connection reliability with a semiconductor chip. SOLUTION: A semiconductor package includes: a photosensitive insulation material 21 having a front surface 21a and a rear surface 21b; a reinforcement material 25 provided on the front surface 21a and having openings 25a exposing parts of the front surface 21a; chips 27, each of which has connection terminals 26 on a surface and is disposed in the opening 25a with the connection terminal 26 facing the front surface 21a; a mold resin 29 provided on the front surface 21a so as to cover the chips 27 and the reinforcement material 25; through holes 30 formed in the photosensitive insulation material 21 and communicating with the connection terminal 26; vias 31, each of which is formed in the through hole 30 and electrically connects with the connection terminal 26; and a wiring structure 38 provided on the rear surface 21b and having a wiring layer 32 electrically connecting with the via 31. COPYRIGHT: (C)2013,JPO&INPIT |
