发明名称 半導体装置
摘要 According to one embodiment, a semiconductor device is provided. The semiconductor device has a first region formed of semiconductor and a second region formed of semiconductor which borders the first region. An electrode is formed to be in ohmic-connection with the first region. A third region is formed to sandwich the first region. A first potential difference is produced between the first and the second regions in a thermal equilibrium state, according to a second potential difference between the third region and the first region.
申请公布号 JP5636254(B2) 申请公布日期 2014.12.03
申请号 JP20100235063 申请日期 2010.10.20
申请人 发明人
分类号 H01L29/861;H01L21/329;H01L29/06;H01L29/868 主分类号 H01L29/861
代理机构 代理人
主权项
地址