发明名称 |
REMOTE THERMAL COMPENSATION ASSEMBLY |
摘要 |
A thermal compensating circuit board (TCB) assembly comprising a substrate, the substrate comprising at least one thermal compensating circuit deposited thereon, the substrate devoid of a solid state emitter, and at least one electrical connector coupled to the at least one thermal compensating circuit, the connector configured to couple with a solid state emitter assembly and/or power supply. Lighting devices comprising the TCB assembly are provided. |
申请公布号 |
EP2807420(A1) |
申请公布日期 |
2014.12.03 |
申请号 |
EP20130703670 |
申请日期 |
2013.01.24 |
申请人 |
CREE, INC. |
发明人 |
DEMUYNCK, RANDY;PROGL, CURT |
分类号 |
F21V23/00;F21V23/04;F21Y101/02;H05B33/08 |
主分类号 |
F21V23/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|