| 摘要 |
A semiconductor package includes a support member having a concave portion formed in one surface thereof. A semiconductor chip is accommodated in the concave portion so that a circuit formation surface of the semiconductor chip is exposed on a side of the one surface of the support member. A wiring structure including a wiring layer electrically connected to the semiconductor chip is formed on the circuit formation surface of the semiconductor chip and the one surface of the support member. A portion of the support member including the one surface is made of silicon or borosilicate glass. |
