| 摘要 |
<p>The present invention relates to a brush for cleaning contaminants of a semiconductor wafer surface and equipment which performs a brush aging process on the brush with the same condition as a process condition set before a process is carried out. A newly manufactured brush is previously worn down on the same condition as a process condition before a CMP process for cleaning a wafer, and also a DI exclusive brush aging system which removes residues in the brush is secured, thereby solving an intrinsic problem that particles are generated in a CMP process of cleaning the wafer. Meanwhile, the shape of embossing formed on the surface of the brush is molded into a sphere shape and a brush with the new shape which fundamentally excludes a phenomenon that particles are separated from the brush in a wafer cleaning process is secured, thereby solving an intrinsic problem that the particles are generated and improving productivity by efficient process management.</p> |
