| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor chip-bonding adhesive which has a low linear expansivity and a low modulus of a cured product and prevents the occurrence of a crack at a conduction part of solder or the like by reducing the occurrence of a stress to the bonded semiconductor chip to enable the production of a semiconductor device having high reliability, and a nonconductive paste and a nonconductive film produced by using the semiconductor chip-bonding adhesive. <P>SOLUTION: The semiconductor chip-bonding adhesive includes an anthracene derivative having an epoxy group or a naphthalene derivative having an epoxy group and a curing agent. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
