Surface treatment method of an electronic device case

摘要

A surface treatment method of an electronic device (800) is provided. The surface treatment method includes processing a first pattern (110) on a surface of a top mold (100, 330, 530) and a second pattern (160) on a surface of a bottom mold (150, 350, 510), coating a Ultra-Violet (UV) molding liquid (120, 170, 320, 370, 520) on each of a front surface of a raw sheet material (200, 310, 500) and the bottom mold (510) facing a rear surface of the raw sheet material raw, positioning the raw sheet material between the top mold (530) and the bottom mold (510), pressing the top mold and the bottom mold to each other, curing the UV molding liquid, and separating the raw sheet material from the top mold and the bottom mold and forming a print layer on the front surface and the rear surface of the raw sheet material.