发明名称 |
PLATING METHOD, PLATING SYSTEM AND STORAGE MEDIUM |
摘要 |
A plating method can improve adhesivity with an underlying layer. The plating method of performing a plating process on a substrate includes forming a first plating layer 23a serving as a barrier film on a substrate 2; baking the first plating layer 23a; forming a second plating layer 23b serving as a barrier film; and baking the second plating layer 23b. A plating layer stacked body 23 serving as a barrier film is formed of the first plating layer 23a and the second plating layer 23b. |
申请公布号 |
KR20140138161(A) |
申请公布日期 |
2014.12.03 |
申请号 |
KR20147025413 |
申请日期 |
2013.02.22 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
TANAKA TAKASHI;INATOMI YUICHIRO;MIZUTANI NOBUTAKA;SAITO YUSUKE;IWASHITA MITSUAKI |
分类号 |
C23C18/16;C25D5/34 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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