Prevention of the propagation of power supply noise from one output circuit to another in a semiconductor device

摘要

A semiconductor device is disclosed. A first power supply wiring for connecting between a first output circuit consisting of a predetermined number of output circuits and a first power supply pad which corresponds to the first output circuit, is connected via a resistor with a second power supply wiring for connecting between a second output circuit consisting of a predetermined number of output circuit and a second power supply pad which corresponds to the second output circuit. Thus, power supply noise that is to be propagated to certain output circuits via in-chip output power supply wirings can be reduced.

主权项

1. A device comprising:
first and second power supply pads, each supplied with a first power supply voltage; first and second circuits; a first power supply wiring interconnecting the first power supply pad to the first circuit; a second power supply wiring interconnecting the second power supply pad to the second circuit; and a first resistor interconnecting the first power supply wiring and the second power supply wiring.