Semiconductor packages and electronic systems including the same

摘要

A plurality of semiconductor chips may be stacked on the substrate, and each of them may include at least one electrode pad. At least one of the plurality of semiconductor chips may include at least one redistribution pad configured to electrically connect with the at least one electrode pad.

主权项

1. A semiconductor device comprising:
a plurality of chips stacked offset each other on a substrate, the plurality of chips comprising: a first chip comprising a plurality of first pads and a plurality of second pads respectively disposed on first and second sides, the two sides being adjacent to each other, the first pads and the second pads connected by respective redistribution lines, and a second chip and a third chip stacked offset each other and electrically connected to each other by direct wire bonding, wherein the first chip is disposed on the second chip and at least one of the second chip and the third chip is electrically connected to the first chip, wherein an imaginary line connecting outer edges of adjacent sides of the plurality of chips form a straight line having at least one turn.