| 发明名称 | Micromechanical structure, in particular sensor arrangement, and corresponding operating method | ||
| 摘要 | A micromechanical structure, in particular a sensor arrangement, includes at least one micromechanical functional layer, a CMOS substrate region arranged below the at least one micromechanical functional layer, and an arrangement of one or more contact elements. The CMOS substrate region has at least one configurable circuit arrangement. The arrangement of one or more contact elements is arranged between the at least one micromechanical functional layer and the CMOS substrate region and is electrically connected to the micromechanical functional layer and the circuit arrangement. The configurable circuit arrangement is designed in such a way that the one or more contact elements are configured to be selectively connected to electrical connection lines in the CMOS substrate region. | ||
| 申请公布号 | US8901679(B2) | 申请公布日期 | 2014.12.02 |
| 申请号 | US201313942744 | 申请日期 | 2013.07.16 |
| 申请人 | Robert Bosch GmbH | 发明人 | Classen Johannes;Hattass Mirko;Tebje Lars;Meisel Daniel Christoph |
| 分类号 | H01L21/48;B81B7/00;B81C1/00;G01P15/08 | 主分类号 | H01L21/48 |
| 代理机构 | Maginot, Moore & Beck LLP | 代理人 | Maginot, Moore & Beck LLP |
| 主权项 | 1. A micromechanical structure, comprising: at least one micromechanical functional layer; a CMOS substrate region arranged below the at least one micromechanical functional layer, the CMOS substrate region having at least one configurable circuit arrangement; and an arrangement of one or more contact elements, said arrangement being arranged between the at least one micromechanical functional layer and the CMOS substrate region and being electrically connected to the micromechanical functional layer and the circuit arrangement, wherein the configurable circuit arrangement is designed in such a way that the one or more contact elements are configured to be selectively connected to electrical connection lines in the CMOS substrate region. | ||
| 地址 | Stuttgart DE | ||