Vertical LED chip package on TSV carrier

摘要

A method of forming a light-emitting device (LED) package component includes providing a substrate; forming an LED on the substrate; and lifting the LED off the substrate. A carrier wafer is provided, which includes a through-substrate via (TSV) configured to electrically connecting features on opposite sides of the carrier wafer. The LED is bonded onto the carrier wafer, with the LED electrically connected to the TSV.

主权项

1. A method of forming a light-emitting device (LED) package component, the method comprising:
providing a substrate; epi-growing an LED on the substrate, wherein the epi-growing the LED on the substrate is performed so that a first side of the LED faces the substrate; lifting the LED off the substrate; providing a carrier wafer comprising a first through-substrate via (TSV) configured to electrically connect features on opposite sides of the carrier wafer; and bonding, after the LED has been lifted off the substrate, the LED onto the carrier wafer, with the LED electrically connected to the first TSV, wherein the bonding the LED onto the carrier wafer is performed so that the LED is bonded to the carrier wafer through the first side of the LED.