发明名称 Welded blister pack for tips
摘要 A blister package for a plurality of pipette tips comprises a support block with a plurality of molded pockets that extends into the support block from a first wall. The plurality of pockets is configured to receive the plurality of pipette tips. At least one reservoir located within the support block at a distal end of and in fluid communication with at least one of the plurality of pockets. A closure member configured to close the plurality of pockets within the support block.
申请公布号 US8900533(B2) 申请公布日期 2014.12.02
申请号 US201213538274 申请日期 2012.06.29
申请人 Molecular Bioproducts, Inc. 发明人 Cohen Jesse B.
分类号 B01L9/00;B01L9/06 主分类号 B01L9/00
代理机构 Wood, Herrons & Evans, LLP 代理人 Wood, Herrons & Evans, LLP
主权项 1. A blister package for pipette tips comprising: a support block comprising joined first and second pieces, each of the first and second pieces comprising: an inner surface configured to be positioned adjacent to and facing the inner surface of the other piece;a plurality of cavities extending into the inner surface such that when the first and second pieces are positioned adjacent to and facing one another, corresponding ones of the plurality of cavities form a pocket extending into the support block from a first wall and being configured to support a pipette tip therein, with each respective pocket having a tapered distal end; a plurality of reservoirs located within the support block and each being formed as an extension of a respective pocket at the tapered distal end of the pocket and in fluid communication therewith; a closure member configured to close the plurality of pockets within the support block.
地址 San Diego CA US