发明名称 A PACKAGING STRUCTURE FOR BUILDING BOARDS AND BUILDING BOARDS LOADING STRUCTURE
摘要 <p>This invention provides packaging structure for building boards and building boards loading structure. A packaging structure comprises plural building boards and plural bands, and wherein the plural building boards are banded at plural locations by the plural bands, and wherein a surface of bands which is located at both ends of the packaging structure, is adhesive. And a building boards loading structure, which loads plural building boards on a pallet, wherein the building boards loading structure comprises plural packages, and wherein the package comprises plural building boards and plural bands, and wherein the plural building boards are banded at plural locations by the plural bands, and wherein the plural packages are loaded on the pallet, and wherein the location of bands in each upper and lower package which is loaded on the pallet is different than each other. And/or wherein the location of bands in lowest package which is loaded on the pallet is different from upper location of the stringers and inserting the fork of the fork lift truck.</p>
申请公布号 CA2616603(C) 申请公布日期 2014.12.02
申请号 CA20072616603 申请日期 2007.12.28
申请人 NICHIHA CORPORATION 发明人 WATANABE, MASARU;HIBINO, YOSHINORI
分类号 B65D19/38;B65D67/00 主分类号 B65D19/38
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