发明名称 Electronic interconnect system
摘要 An electronic interconnect system comprises: a motherboard having electrical contacts on its upper and lower surfaces along a selected edge; an electronic module comprising a circuit board with electronic devices mounted thereon, and further comprising two opposing flexible portions that are openable outwardly from one another, the flexible portions having electrical contact pads on the opposing surfaces, so that when the flexible portions are placed on either side of the edge of the motherboard the pads align with contacts on the respective surfaces of the motherboard and make electrical contact therewith.
申请公布号 US8902606(B2) 申请公布日期 2014.12.02
申请号 US201213573964 申请日期 2012.10.17
申请人 Microelectronics Assembly Technologies 发明人 Clayton James E.;Fathi Zakaryae
分类号 H05K7/00;G06F1/16 主分类号 H05K7/00
代理机构 代理人 Lauf Robert J.
主权项 1. An electronic interconnect system comprising: a motherboard having a plurality of electrical contacts on its upper and lower surfaces along a selected edge thereof; and, an electronic module comprising a circuit board with electronic devices mounted thereon, and further comprising two opposing flexible circuit strips along one edge thereof that are openable outwardly from one another, said flexible circuit strips having a plurality of electrical contact pads on the opposing surfaces thereof, so that when said flexible circuit strips are placed on either side of said edge of said motherboard said pads align with said contacts on the respective surfaces of said motherboard and make electrical contact therewith.
地址 Research Triangle Park NC US