发明名称 Component support and assembly having a MEMS component on such a component support
摘要 A component support allows cost-effective, space-saving and low-stress packaging of MEMS components having a sensitive structure. The component support is suited, in particular, for MEMS components, which are mounted in the cavity of a housing and are intended to be electrically contacted. The component support is produced as a composite part in the form of a hollow body open on one side, the composite part being made essentially of a three-dimensionally shaped carrier foil flexible in its shaping, and an encasing material. The encasing material is molded onto one side of the carrier foil, so that the carrier foil is situated on the inner wall of the component support. At least one mounting surface for at least one component is formed on the inner wall having the carrier foil. The carrier foil is also provided with contact surfaces and insulated conductive paths for electrically contacting the at least one component.
申请公布号 US8902604(B2) 申请公布日期 2014.12.02
申请号 US201213402321 申请日期 2012.02.22
申请人 Robert Bosch GmbH 发明人 Zoellin Jochen;Ehrenpfordt Ricardo;Scholz Ulrike
分类号 H05K1/18;H04R25/00;H04R9/08;H04R11/04;H04R17/02;H04R19/04;H04R21/02;G01L19/00;B81B7/00;G01L19/14;H04R19/00;H04R1/08 主分类号 H05K1/18
代理机构 Kenyon & Kenyon LLP 代理人 Kenyon & Kenyon LLP
主权项 1. A component support, for at least one MEMS component, which is mounted in the cavity of a housing and electrically contacted, comprising: a component support arrangement, including: a composite part that is essentially made up of a three-dimensionally shaped carrier foil flexible in its shaping and an encasing material, which is molded onto the carrier foil on one side, so that the carrier foil is situated on the inner wall of the component support arrangement; and at least one mounting surface for at least one component, wherein the at least one mounting surface is formed on the inner wall having the carrier foil; wherein the carrier foil has contact surfaces and insulated conductive paths for electrically contacting the at least one component, wherein the component support is produced as the composite part in the form of a hollow body open on one side, and wherein the carrier foil extends along a first dimension and along a second dimension disposed at a non-zero angle to the first dimension, along surfaces of the composite part at different elevations from one another.
地址 Stuttgart DE