Mitigation of block bending in a ring laser gyroscope caused by thermal expansion or compression of a circuit board

摘要

An apparatus includes a sheet of circuit board material, at least one electrically conductive trace positioned on the sheet of circuit board material, and at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace. The apparatus further includes at least one deformation point configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression.

主权项

1. An apparatus comprising:
a sheet of circuit board material; at least one electrically conductive trace positioned on the sheet of circuit board material; at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace; a first connection point configured to connect the sheet of circuit board material to an object resisting expansion or compression; a second connection point configured to connect the sheet of circuit board material to the object resisting expansion or compression; and at least one deformation point positioned between the first connection point and the second connection point and configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to the object resisting expansion or compression at the first connection point and the second connection point, wherein the absorption of stresses developed in the sheet of circuit board material minimizes the transfer of the stresses to the object resisting expansion or compression.